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Checklist: IPC-A-610 visual inspection

The points a visual inspection of a solder joint is based on

Use this checklist as a systematic review when you visually inspect solder connections and components according to the principles in IPC-A-610.

§The solder joint

  • 01Does the solder have an even, concave fillet shape?
  • 02Does the solder have good wetting to both component and solder surface?
  • 03Are there no solder bridges between adjacent pads?
  • 04Is there no 'tombstoning' – components that have risen at one end?
  • 05Are continuous holes filled enough without large voids?

§The component

  • 01Is the component centered and straight in its position?
  • 02Are components with polarity (diode, IC, capacitor) turned correctly?
  • 03Are there no visible signs of heat damage from reflow or soldering?
  • 04Is mechanical fastening in place where required?

§The card

  • 01Are there no signs of delamination or 'measling' in the printed material?
  • 02Is the board clean and free of foreign objects and solder splashes?
  • 03Is the marking and text on the board legible?